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LogInPack brought together representatives of various logistics and packaging sectors, as well as experts, suppliers and industry leaders.

The Congress discussed the latest trends, innovations and challenges in logistics and packaging. The speakers presented many interesting concepts and solutions aimed at optimizing logistics processes, increasing efficiency and minimizing the environment impact.

Topics covered during the two days convention: Best practices in export packaging, niche aspects of the industry, including intelligent packaging and certification of packaging in the transport of hazardous materials, the use of artificial intelligence to improve a logistics company’s business operation, modern tools and instruments for managing a logistics company, safety in maritime logistics, effective solutions for logistics and packaging companies or trends in warehouse technologies.

Speakers at the LogInPack Congress:

Krzysztof Sarnecki President of the Board, Partner at QUEST CM An entrepreneur. One of the few professional negotiators on the Polish market, strategic consultant, business trainer,

Andrzej Bułka - President of the board at Fracht FWO Polska,  a graduate of the Navigation Faculty of the Maritime University of Szczecin (now the Maritime University of Technology).

Janusz Piechociński. The president of the Chamber is the former Deputy Prime Minister, Minister of Economy in 2012-2015 - Janusz Piechociński is the event’s special guest. At his term of office, he participated in meetings at the highest level with representatives of over 120 countries, actively promoting the Polish economy and its products, as well as encouraging investment in Poland.

Marcin Królski - Co-founder and board member of Relopack LLC,  an entrepreneur with a passion for modern technologies and classic philosophical theories, which he tries to combine in everyday business.

Paweł Flieger - a President of the Management Board of Gamedust S.A. An entrepreneur, investor and manager, for years, he heas been associated with the development of computer games.

The Congress announces the International Trade Fair for the Packaging Industry IN-PACK scheduled for 13-15 February 2024.